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Lumentum, at OFC 2019, is showcasing advanced high-speed laser devices that enable next generation 5G wireless and datacenter transceivers. Offering a comprehensive family of high performance laser chip solutions, including vertical cavity surface emitting lasers (VCSEL), directly modulated lasers (DML), and externally modulated lasers (EML), Lumentum leverages its expanded manufacturing footprint and integral materials expertise in Indium Phosphide (InP) and Gallium Arsenide (GaAs).
Lumentum's high-performance laser devices provide a wide range of data rates, NRZ and PAM4 modulation formats, and customization, operating in both cooled and un-cooled configurations addressing the 10G to 400G wireless and datacenter transceiver market. Devices are qualified as self-hermetic – capable of reliable operation in non-hermetic enclosures per Telcordia GR-468 standards. Lumentum DMLs offer high reliability and use a pioneering cavity design to operate with high speed over the wide temperature ranges demanded by the latest 5G wireless systems.
Communications VCSELs for short-reach multimode fiber solutions and PAM4 leverage Lumentum's expertise in high-volume 3D sensing laser technology and volume manufacturing. They deliver top performance in data centers and can be supplied as a single bare die, or 1x4 arrays. The new EMLs optimized for PAM4 applications are now shipping in volume to enable the move to next-generation 400G solutions that dramatically reduce the price per bit in data centers. Lumentum is the first company to ship volume production quantities of these high-speed EMLs for PAM4, according to Mike Staskus, product line manager, Datacom.
Lumentum laser chips enable a wide variety of standards-compliant modules for high-speed networking. For example, 400G transceivers including QSFP56-DD DR4, FR4, LR4, OSFP FR4, LR4, and CFP8 LR8; 100G transceivers QSFP28 DR, FR, CWDM4, LR4, and 4WDM-20.
Click here for more highlights from OFC 2019.