Cutting-Edge Laser Technology for Sensitive Circuitry Protection During Manufacturing

Posted Oct 18, 2019 by HZO

HZO, a provider of nanocoatings for electronics, has unveiled its commercial availability of laser technology and advanced plasma processes for the automated removal of materials critical to enabling protection of electronic assemblies. This latest breakthrough provides multiple options for 2D and 3D inline material removal, reducing overall labor and capital cost while providing a highly scalable and repeatable manufacturing process.

Laser Ablation and Plasma Ashing represent the latest in R&D innovation from HZO. This technology offers customers the ability to seamlessly and systematically remove coating materials from critical test points and connectors while maintaining the integrity of the protection afforded by thin film coatings like Parylene.

Combined with HZO’s recently announced PRO750 GEN4 Coating Chamber, HZO’s ability to apply leading-edge technology for material removal reduces handling, increases throughput, improves accuracy, and delivers a higher quality service to its customers. Savings are derived from reduced capital requirements and materials associated with board-level preparation, as well as lower labor and training demands.

HZO’s New Laser Ablation and Plasma Ashing Equipment Enable:

  • Precise and efficient material removal resulting in improved throughput and higher yields for protected circuitry.
  • Minimally invasive, commercially scalable, proven material management processes that do not require solvents, oils, or coolants.
  • Increased manufacturing flexibility to achieve superior protection, including up to IPX8.

Laser Ablation removes coating materials from a solid two-dimensional surface by irradiating it with a laser beam, with extraordinary speed and accuracy. For three dimensional surfaces, HZO employs a process known as Plasma Ashing, capable of removing materials from irregular surfaces through the application of ions and radicals generated by a plasma application process. Both approaches are safe, environmentally friendly, non-destructive to delicate electronics, and contributes to HZO’s extensive intellectual property and patent portfolio.