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Ranovus Inc, a leading provider of next generation of interconnects solutions, has announced collaboration with industry leaders, IBM, TE Connectivity and SENKO, to create an ecosystem for designing and manufacturing multi-vendor solutions for co-packaged optics applications in data centers.
The Collaboration Leverages:
Ranovus’ latest highly scalable, Odin Silicon Photonics Engine. Odin incorporates the company’s disruptive innovation in multi-wavelength Quantum Dot Laser (QDL), 100Gbps Silicon Photonics based Micro Ring Resonator modulators and photodetectors, 100Gbps Driver, 100Gbps TIA and control Integrated Circuits in a power efficient and cost-effective EPIC in a single chip.
IBM’s innovative Fiber V-groove Interconnect Packaging technology, which is a robust and reliable assembly technique to interface optical fibers to silicon photonics devices. This process makes use of passive alignment techniques and achieves low insertion loss across a wide spectral range in both the O-band and C-band regimes. The solution is scalable in physical channel count and the automated process provides a path to high-volume manufacturing of co-packaged optics.
TE’s Co-Packaged (CP) Fine Pitch Socket Interposer technology that enables integration of small chipset and optical engine component technologies into high-value co-package assemblies with re-workable and interoperable interfaces. The signal integrity performance of the CP fine pitch socket interposer technology can be critical to 100 Gbps high density electrical packaging. The integration of TE’s thermal bridge technology completes the assembly by providing an innovative solution for thermal management of the switch, serializer/deserializer (SerDes), and optics necessary for high reliability and long operating life.
SENKO’s Fiber Optic Connectivity Solutions, for optical coupling, on-board/mid-board, and faceplate which support 100Gbps/lane and beyond co-packaged optics equipment designs. These include low profile and precision Fiber coupler assemblies, micro sized on-/mid-board connectors, reflow compatible connector assemblies, and space saving connector options for faceplate. These will provide more efficiency, scalability, and flexibility in designs for Co-Packaged Optics equipment.
With data center traffic growing at an unprecedented pace, the networking infrastructure needs to scale in capacity while maintaining its total power consumption and footprint. Today’s disaggregated Ethernet switch IC and optical module architecture does not provide the scalability required to support the future growth of the data centers. Co-packaging of optics and Ethernet switch ICs is a natural next step to reduce the power consumption burden of the electrical I/Os in the data center networking equipment. The transition of the Ethernet switch IC SER/DES from 50Gbps to 100Gbps, in 25.6Tbps and 51.2Tbps switch configurations, presents a unique inflection point in the architecture of the Ethernet switch systems.