Teledyne Imaging Presents LACera CMOS Imaging Technology

Posted Mar 01, 2021

Teledyne Imaging has announced the introduction of a new advanced imaging technology, LACera. The technology is a significant step forward in CMOS capabilities for advanced imaging which will enable the next generation of scientific discovery. Exclusively developed by Teledyne Imaging (part of Teledyne Technologies), LACera draws on Teledyne’s decades of expertise in CMOS sensor and camera development.

Scientific imaging, spanning x-ray to near infrared (NIR) regions, is critical to emerging applications in life and physical sciences. Applications as diverse as next generation genomics, astronomical photometry, ultra-high-resolution x-ray and electron imaging require CMOS sensors and cameras with low light sensitivity and speed. LACera CMOS technology delivers greater than 90% quantum efficiency and proprietary low noise architecture with up to 18-bit readout – a combination of performance not previously available in wafer scale sensors.

LACera technology will be exclusively featured in next generation CMOS cameras to be announced later this year and includes x-ray, EUV and VIS-NIR versions. With vast CMOS sensor and camera design capabilities, Teledyne is ready to serve the next generation of research and OEM customers. 

For more information about the LACera CMOS technology, click here