imec and SMART Photonics Forge Partnership to Propel Hybrid Integration of InP on SiN/SiPh

Posted  by GoPhotonics


imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and SMART Photonics have signed a Memorandum Of Understanding (MOU) to underpin their intention to work together in the field of hybrid integration of InP on SiN/SiPh.

This collaborative work will include topics like:

– Hybrid integration of InP on SiN/SiPh with Flip chip bonding and butt coupling

– Hybrid integration of InP on SiN/SiPh with micro-transfer printing

– Component design i.e. laser design and design of interface elements for the integration of InP/SiPh along with system demonstration and prototyping.

Via this cooperation, imec and SMART Photonics intend to accelerate the adoption and market pull of hybrid integrated solutions for domains such as datacom, automotive, agrifood and health.

About imec 

imec is globally recognized as a leading research and innovation hub in nanoelectronics and digital technologies. It operates at the forefront of system-on-chip advancements, capitalizing on progress in diverse domains, including 3D integration. The organization is dedicated to expanding memory capacity by pushing existing memory technologies to their limits. Additionally, imec is at the forefront of exploring innovative memory technologies to further enhance memory density, speed, and power consumption.

About SMART Photonics 

SMART Photonics, located in Eindhoven, The Netherlands, is a foundry offering production services for mainly Indium Phosphide based photonic components. The company serves as an independent pure-play foundry, using our knowledge, experience and equipment to produce photonic components for our customers, based on their designs.

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