https://cdn.gophotonics.com/news/ccv_639111463573824893.webp712370
Jabil, a global manufacturing solutions provider, and Mikros Technologies, a Jabil company and innovator in thermal management, unveiled Broadcom’s new liquid-cooled 3.5D XDSiP. Built for gigawatt-scale AI clusters, the 3.5D XDSiP combines advanced 2.5D and 3D-IC Face-to-Face (F2F) integration to deliver 7x higher interconnect density, 10x lower die-to-die power consumption, and reduced latency, enabled by Mikros Technologies’ ultra-thin cold plate, which provides 5,000+ W chip-level cooling in a 1U-ready form factor for high-density AI and optical networking deployments.
“As Broadcom continues to push the boundaries of custom silicon for AI and high-performance computing, the ability to manage multi-kilowatt thermal design powers (TDP) is no longer just a challenge; it is a requirement for thermal solvency,” said Ken Kutzler, VP of AI Systems Development for Broadcom's ASIC Products Division. “By partnering with Mikros Technologies and Jabil, we are ensuring our custom 5 kW XPU customers have access to a robust ecosystem of high-performance cooling. Their microchannel technology provides the critical chip-level thermal resistance necessary to unlock the full performance of our ASICs, enabling a seamless chip-to-chiller liquid cooling path that is essential for the next generation of high-density AI data centers.”
About Jabil
Jabil is a global manufacturing solutions provider that helps businesses stay competitive by reducing costs, accelerating time-to-market, and enabling a sharper focus on core competencies. Going beyond traditional manufacturing services, Jabil partners with leading brands across industries such as AI cloud data centers, healthcare, robotics, automotive, warehouse automation, and energy. From early-stage concepts to fully realized innovations, the company transforms ideas into the products that power everyday life. With a strong global footprint and deep expertise in engineering, supply chain, and manufacturing, Jabil delivers consistent quality and scalable solutions across sectors including medical devices, digital payments, data centers, and semiconductor equipment.