The GLT5009BSI from Gpixel Inc. is a 9k Line Scan CMOS Image Sensor that has two photosensitive bands: P1 with a resolution of 9072 (H) × 256 (V) and P2 with a resolution of 9072 (H) × 32 (V) pixels. It has a global shutter in a 1.78" optical format with an active pixel size of 5 μm x 5 μm. This backside illuminated (BSI) CMOS image sensor has line rates up to 600 kHz (at 10-bit ADC) & 300 kHz (at 12-bit ADC) and maximum data rate of up to 74.304 Gbps. It has a dynamic range of 63.6 dB (10-bit) & 68.7 dB (12-bit) and peak quantum efficiency of 82.4% (at 550 nm). This image sensor has a photosensitive area of 45.36 mm x 1.28 mm (P1) & 45.36 mm × 0.16 mm (P2) with a full well capacity of 15.8 ke- (at 10-bit) & 19.2 ke- (at 12-bit). It has an input clock rate of 36 MHz and Photo Response Non-Uniformity of 0.6% (at 128 stage). This image sensor has a charge transfer of greater than 0.99993 and dark current of 4 ke-/s/pixel.
The GLT5009BSI is a Time delay integration (TDI), charge domain CMOS image sensor designed to meet the needs of high speed and low light applications by maximizing sensitivity from the ultraviolet to the near-infrared with state-of-art BSI scientific CMOS technology and has up to 256 true TDI stages. It supports 10-bit dual band HDR mode, 84/42/21/12/6/3 channel multiplexing & selectable 2 scan directions (forward & reverse), and integrates an on-chip sequencer. This image sensor has 84 x sub-LVDS for effective data output, 2 x sLVDS for OB data output, and 3 x sLVDS for DDR clock outputs. It requires a DC supply voltage of 5V (analog) & 1.8 V (digital & ADC) and consumes up to 5.5 W (at 300 kHz) of power. This CMOS image sensor is available in a 269-pin µPGA package and is ideal for FPD inspection, PCB inspection, wafer inspection, fluorescence imaging, and digital pathology applications.