GSPRINT6502BSI

CMOS Image Sensor by Gpixel Microelectronics Inc.

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The GSPRINT6502BSI from Gpixel Microelectronics Inc. is a 2.36 Megapixel CMOS Image Sensor that has a resolution of 2048 (H) x 1152 (V) pixels. It has a global shutter in a 1” optical format that delivers a frame rate of up to 1500 fps or 2941 fps (at 1 x 2 binned). This backside illuminated (BSI) CMOS image sensor has a pixel size of 6.5 μm x 6.5 μm and data rate of 38.4 Gbps. It has a dynamic range of 57 dB and quantum efficiency above 80%. This CMOS image sensor has a photosensitive area of 13.1 mm x 7.5 mm and full well capacity of 20 ke-. 

The GSPRINT6502BSI supports 32 pairs of Sub-LVDS output format, produces mono output, and has up to 8 vertically oriented regions of interest. This CMOS image sensor has a 10-bit ADC and temporal noise of 24.3 e-. It requires a DC supply voltage of 1.2 V (digital), 3.3 V or 3.6 V (analog) & 1.8 V (I/O) and consumes less than 1.9 W of power. This CMOS image sensor is available in a 130-pin LGA package that measures 25.66 mm x 22.05 mm and is ideal for 3D laser profiling & scientific imaging applications.

Product Specifications

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Product Details

  • Part Number
    GSPRINT6502BSI
  • Manufacturer
    Gpixel Microelectronics Inc.
  • Description
    2.36 Megapixel CMOS Image Sensor for 3D Laser Profiling Applications

General Parameters

  • Resolution
    2048 (H) x 1152 (V)
  • Mega Pixels
    2 MP
  • Optical Format
    1 Inches
  • Shutter Type
    Global Shutter
  • Frame Rate
    >1500 to 2941 fps
  • Pixel
    2 MP
  • Pixel Size
    6.5 µm x 6.5 µm
  • Imaging Area
    13.3 x 7.5 mm (photosensitive area)
  • Data Rate
    38.4 Gbps
  • Dynamic Range
    57 dB
  • Pixel Type
    BSI
  • Chroma
    Monochrome
  • ADC Resolution
    10 Bit
  • Type
    Area Image Sensor
  • Supply Voltage
    3.3 to 3.6 V (Analog), 1.8 V (I/O), 1.2 V (Digital)
  • Power Consumption
    <1.9 W
  • Package Type
    LGA
  • Note
    Full well capacity: 20 ke-, Quantum efficiency: 80%, Temporal noise: 24.3 e-

Connections & Interface

  • Interface
    Sub-LVDS, SPI

Applications

  • Application
    Laser 3D Profile, Scientific Imaging

Physical Properties

  • Optical Diagonal
    15.3 mm
  • Package
    130 Pins LGA
  • Dimensions
    25.66 x 22.05 mm

Technical Documents

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