CAS850150MW

Laser Diode by Vertilite

Note: Your Quotation Request will be directed to Vertilite.

The CAS850150MW from Vertilite is a Vertical-Cavity Surface-Emitting Laser (VCSEL) Diode that operates at a wavelength of 850 nm. It delivers an optical output power of 155 mW with a power conversion efficiency of 40% and slope efficiency of 1 W/A. This laser diode has a full beam divergence of 25 deg and differential resistance of 2.6 Ohms. It has a spectral width (RMS) OF 1 nm and wavelength coefficient of 0.07 nm/oC. This laser diode has 24 emitters with an emitter pitch of 42 (x) and 52 (y). It requires a threshold current of 40 mA, DC supply voltage of 2.1 V, and consumes a current of 185 mA. This laser diode is available in a chip on submount package that measures 330 ± 15 (L) µm x 330 ± 15 (W) µm x 100 ± 10 (H) µm and is ideal for 3D sensing applications.

Product Specifications

View similar products

Product Details

  • Part Number
    CAS850150MW
  • Manufacturer
    Vertilite
  • Description
    850 nm Vertical-Cavity Surface-Emitting Laser Diode for 3D Sensing Applications

Applications

  • Application
    3D Sensing

General Parameters

  • Technology
    Vertical-Cavity Surface-Emitting Laser (VCSEL)
  • Type
    Free Space Laser Diode
  • Operation Mode
    CW Laser, Pulsed Laser
  • Wavelength
    840 nm, 850 nm, 860 nm
  • Output Power
    120 to 155 mW
  • Output Power
    120 to 155 mW
  • Spectral Width (FWHM)
    1 to 2.5 nm
  • Slope Efficiency
    0.9 to 1 W/A
  • Beam Divergence
    13 to 29 Degree
  • Emitter Width
    330±15 µm
  • Wavelength Temp. Coefficient
    0.07 to 20 nm / Degree C
  • Power Conversion Efficiency
    35 to 40%
  • Threshold Current :
    40 to 50 mA
  • Operating Current
    185 mA
  • Operating Current
    185 mA
  • Operating Voltage
    2.1 to 2.4 V
  • Differential Resistance
    2.6 to 4 Ohms
  • Laser Color
    Infrared
  • Emitting Area
    42 x 52 µm (Pitch)
  • Emitting Size/Emitter Chip
    330 x 330 x 100 µm (L x W x H)
  • Number of Emitters
    24
  • Package Type
    Sub-Mount
  • Package
    Chip on Sub-Mount

Temperature

  • Operating Temperature
    0 to 70 Degree C
  • Storage Temperature
    -40 to 105 Degree C

Technical Documents

Click to view more product details on manufacturer's website
Request a Quote