Quasar Series

Laser by Spectra-Physics

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The Quasar Series from Spectra-Physics are UV/Green Hybrid Fiber Lasers that operate at a wavelength of 355 and 532 nm. They provide an output power of over 38-95 W with ±3% power stability and pulse energy of over 400 μJ with up to ±5% pulse-to-pulse energy stability. These vertically polarized lasers produce a beam of diameter 3.5 mm with beam divergence from 0.3-0.45 mrad and a beam pointing stability better than ±25 μrad. They have a pulse width of 2-100 ns, 0-3.5 MHz repetition rate and a warm-up time of 40-60 minutes.

The Quasar Series uses TimeShift technology to keep pulse width constant over a wide range of repetition rates, vary pulse width, shape pulses and for Pulse Splitting & Burst modes. They have a built-in ALPS (Active Laser Purification System) that helps sustain their performance for long life. This laser requires an AC supply of 190-240 V and consumes up to 2400 W of power. They are available in a laser head module that measures 1000 x 373 x 235 mm and has a 5 m cable. These lasers are ideal for glass cutting and drilling, PCB & electronic package cutting and drilling, LEDs/semiconductor scribing/dicing, solar/photovoltaics processing, ceramics cutting & drilling, CFRP cutting, drilling & surface texturing, lithium-ion battery foil cutting and other industrial manufacturing applications.

Product Specifications View similar products

Product Details

  • Part Number
    Quasar Series
  • Manufacturer
  • Description
    355/532 nm UV/Green Hybrid Fiber Lasers

General Parameters

  • Configuration
    Laser Head with Control Unit (Integrated), OEM Laser Module
  • Type
    Laser System
  • Operation Mode
    Pulsed Laser
  • Ultrafast Laser
    Nanosecond Lasers
  • Wavelength
    355 nm, 532 nm
  • Tunable
  • Fiber Coupled
  • Laser Color
    Ultraviolet, Green
  • Power
    38 to 95 W
  • Pulse Energy
    12 to 475 µJ
  • Pulse Width
    <2 to >100 ns
  • Application
    Glass Cutting and Drilling, PCB Drilling, PCB Cutting and Depaneling, HDI (high Density Interconnects), Si Crystallization, Si Wafer Dicing, Low K Dielectric Grooving, Ceramic Processing, LED Processing, Solar Cell Processing, ITO Patterning, Photolithography, CFRP Cutting and Drilling, Thin Film Planar Battery Cutting, Drilling And Scribing MDM Polymers, Surface Texturing, Litihum Ion Battery Foil Cutting
  • Polarization
    Vertical, Horizontal
  • Polarization ratio
  • Repetition Rate
    0 to 3.5 MHz
  • Warm up time
    40 to 60 min
  • Altitude
    0 to 2000 m (Operating), 0 to 10000 m (Storage)
  • Application Industry
    Industrial (Material Processing), Semiconductors & Microelectronics
  • Beam Divergence
    <0.3 mrad, < 0.45 mrad
  • Beam Quality Factor (M2)
  • Transverse Mode
  • Laser Class
    Class IV
  • Energy Stability
  • Power Consumption
    2000 to 2400 W
  • Power Stability
    <2%, ±3%
  • Pointing Stability
    <±25 µrad/°C
  • Pulse Energy
    12 to 475 µJ
  • Package
  • Power Supply
    190 to 240 VAC, 2500 W maximum, 50/60 Hz, single phase
  • Voltage
    190 to 240 V
  • RoHS
  • Note
    Cable Length: 5 m

Physical Properties

  • Laser Head Dimension
    39.4 x 14.7 x 9.3 Inches (L x W x H)
  • Laser Head Weight
    90 kg
  • Power Supply Dimension
    21.1 x 19.0 x 6.9 Inches (L x W x H)
  • Power Supply Weight
    16 kg
  • Dimension
    39.4 x 14.7 x 9.3 Inches (L x W x H) (Laser Head), 21.1 x 19 x 6.9 Inches (L x W x H) (Power Supply)
  • Weight
    90 kg (Laser Head), 16 kg (Power Supply)
  • Beam Diameter
    3.5 ±0.35 mm

Environmental Conditions

  • Relative Humidity
    10 to 80%
  • Operating Temperature
    15 to 35 Degree C
  • Storage Temperature
    0 to 50 Degree C

Technical Documents

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