Quasar UV80

Laser by Spectra-Physics

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The Quasar UV80 from Spectra-Physics is a UV/Green Hybrid Fiber Laser that operates at a wavelength of 355 nm. It delivers an output power of over 80 W with ±3% power stability and pulse energy of over 400 μJ with ±5% pulse-to-pulse energy stability. This vertically polarized laser produces a beam of diameter 3.5 mm with a beam divergence less than 0.3 mrad and a beam pointing stability of ±25 μrad. It has a pulse width of 2 - 100 ns, a repetition rate of up to 3.5 MHz, and a warm-up time of 40-60 minutes.

The Quasar UV80 uses TimeShift technology which enables pulse energy programmability in the time domain as well as pulse splitting and burst mode operation. It has a built-in ALPS (Active Laser Purification System) that helps sustain its performance for long life. This laser requires an AC supply of 190 - 240 V and consumes up to 2400 W of power. It is available in a laser head module that measures 1000 x 373 x 235 mm and has a 5 m cable. This laser is ideal for glass cutting and drilling, PCB & electronic package cutting and drilling, LEDs/semiconductor scribing/dicing, solar/photovoltaics processing, ceramics cutting & drilling, CFRP cutting, drilling & surface texturing, lithium-ion battery foil cutting, and other industrial manufacturing applications.

Product Specifications View similar products

Product Details

  • Part Number
    Quasar UV80
  • Manufacturer
  • Description
    355 nm, UV/Green Hybrid Fiber Laser for Fast Precision Micromachining

General Parameters

  • Configuration
    Laser Head with Control Unit (Integrated), OEM Laser Module
  • Type
    Laser System
  • Operation Mode
    Pulsed Laser
  • Ultrafast Laser
    Nanosecond Lasers
  • Wavelength
    355 nm
  • Tunable
  • Fiber Coupled
  • Laser Color
  • Power
    80 W
  • Pulse Energy
    400 µJ
  • Pulse Width
    <2 to >100 ns
  • Application
    Glass Cutting and Drilling, PCB Drilling, PCB Cutting and Depaneling, HDI (high Density Interconnects), Si Crystallization, Si Wafer Dicing, Low K Dielectric Grooving, Ceramic Processing, LED Processing, Solar Cell Processing, ITO Patterning, Photolithography, CFRP Cutting and Drilling, Thin Film Planar Battery Cutting, Drilling And Scribing MDM Polymers, Surface Texturing, Litihum Ion Battery Foil Cutting
  • Polarization
  • Polarization ratio
  • Repetition Rate
    0 to 3.5 MHz
  • Warm up time
    40 to 60 min
  • Altitude
    0 to 2000 m (Operating), 0 to 10000 m (Storage)
  • Application Industry
    Industrial (Material Processing), Semiconductors & Microelectronics
  • Beam Divergence
    <0.3 mrad
  • Beam Quality Factor (M2)
  • Transverse Mode
  • Laser Class
    Class IV
  • Energy Stability
  • Power Consumption
    <2400 W
  • Power Stability
    <2%, ±3%
  • Pointing Stability
    <±25 µrad/°C
  • Pulse Energy
    400 µJ
  • Package
  • Power Supply
    190 to 240 VAC, 2500 W maximum, 50/60 Hz, single phase
  • Voltage
    190 to 240 V
  • RoHS
  • Note
    Cable Length: 5 m

Physical Properties

  • Laser Head Dimension
    39.4 x 14.7 x 9.3 Inches (L x W x H)
  • Laser Head Weight
    90 kg
  • Power Supply Dimension
    21.1 x 19.0 x 6.9 Inches (L x W x H)
  • Power Supply Weight
    16 kg
  • Dimension
    39.4 x 14.7 x 9.3 Inches (L x W x H) (Laser Head), 21.1 x 19 x 6.9 Inches (L x W x H) (Power Supply)
  • Weight
    90 kg (Laser Head), 16 kg (Power Supply)
  • Beam Diameter
    3.5 ±0.35 mm

Environmental Conditions

  • Relative Humidity
    10 to 80%
  • Operating Temperature
    15 to 35 Degree C
  • Storage Temperature
    0 to 50 Degree C

Technical Documents

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