LED by Broadcom

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The HSMF-C11B from Broadcom is a Tricolor Top Mount ChipLED which uses Aluminum Indium Gallium Phosphide (AllnGaP) and Indium Gallium Nitride chip technology that enables this product to deliver industry-leading light output performance. The chipLED is compatible with reflow soldering processes. This LED is available in a very small package size of 1.08 mm × 1.08 mm and it has the thinnest package height in Broadcom's tricolor ChipLED family. This ultra-thin profile feature makes this LED ideal for applications that require low package height such as for indicators and backlighting, and the small package footprint allows the LEDs to be capable of supporting assembly in a close pitch configuration. For easy pick-and-place, the parts are packed in 8 mm tape and 7-inch diameter reel. Every reel is shipped from a single intensity and color bin for better uniformity control.

Product Specifications

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Product Details

  • Part Number
  • Manufacturer

General Parameters

  • Chip Technology
    Aluminum Indium Gallium Phosphide (AllnGaP), Indium Gallium Nitride
  • Colors
    Red, Green, Blue
  • Configuration
  • RoHS
  • Viewing Angle
    140 Degree
  • Forward Voltage
    1.6 to 3.15 V
  • Forward Current
    10 mA
  • Luminous Intensity mcd :
    18 to 112.5 (blue), 112.5 to 450 (Green), 45 to 285 (Red)
  • Wavelength
    626 nm (red), 527 nm (green), 473 nm (blue)

Physical Properties

  • Package
    Tape and Reel
  • Package Type
    Chip, Surface Mount
  • Size
    1.08 mm x 1.08 mm

Environmental Conditions

  • Junction Temperature
    95 Degree C
  • Soldering Temperature
    310 Degree C
  • Operating Temperature
    -40 to 85 Degree C


  • Application
    Backlighting, Indicator

Technical Documents

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