The FPA 640x512_P15-1.9-TE2 from ANDANTA is an InGaAs SWIR Sensor that has a spectral range of 1.1 µm - 1.9 µm. It has a quantum efficiency fill factor (QEFF) above 70 % (at 1700 nm) and an actual pixel array of 640 (H) x 512 (V) pixels. This SWIR sensor has a pixel operability of 99 % and pixel pitch of 15 µm. It has an effective pixel array of 636 (H) x 508 (V) pixels and image size of 9.6 mm x 7.68 mm. This SWIR sensor has a charge capacity of 0.041 Me- (at high gain, 46.2 µV/e-), 0.118 Me- (at mid gain, 16.2 µV/e-), and 1.38 Me- (at low gain, 1.39 µV/e-).
The FPA 640x512_P15-1.9-TE2 has a planar InGaAs PIN sensor technology with dark current of up to 100 fA and readout noise below 35 e-RMS. This SWIR sensor has a response nonuniformity of 10 % and response nonlinearity of 4 %. It has an output swing of 2.25 V and a minimum integration period of up to 1 µs. This SWIR sensor has a built-in temperature sensor with an embedded thermoelectric cooler. It has three readout modes: snapshot ITR/IWR & IMRO and 2,4, or 8 outputs with a pixel rate of less than 18 MHz.
The FPA 640x512_P15-1.9-TE2 is available in a 28-pin metal SDIP package that measures 36.1 mm (L) x 25.4 mm (W) x 7.3 mm (T) and is ideal for Shortwave-Infrared Imaging, hyper- / multi-spectral imaging, semiconductor inspection/process monitoring, waste recycling, medical science & biology, see through fog/smoke, ice/slush/moisture mapping, high-speed industrial thermal imaging, laser beam profiling, and mineral identification applications.
