Tackling Thermal Management Challenges in Semiconductor-Pumped Nd:YAG Systems
Semiconductor-pumped solid-state lasers are commonly used in Quasi-Continuous Wave (QCW) for high peak power output and in Continuous Wave (CW) for high average power output. In semiconductor-pumped solid-state lasers, the height of the heat sink and the spacing between chips (i.e., the combined thickness of the substrate and chip) significantly affect the product's cooling capacity. A larger spacing between chips results in better heat dissipation but increases the size of the product. Conversely, reducing the chip spacing decreases the product size but may compromise its cooling ability. Designing an optimally compact semiconductor-pumped solid-state laser that meets cooling requirements presents a significant challenge.
