Held in co-operation with the Fraunhofer EMFT’s forum BE-FLEXIBLE 2017, the FLEX Europe Conference takes advantage of the intersection of PE and thin silicon (Si) devices. Key technical topics expected to be covered include Thin Silicon, Flexible Sensors, Hetero-integration on Flex, Bendable Electronics, Reliability of Flexible Electronics, and Robotics. Markets being impacted by FHE include structural health monitoring, the Internet of Things (IOT), and medical devices, among others.