CS International 2019 to Focus on the NextGen of Compound Semiconductor Industry

Posted  by GoPhotonics

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The CS International Conference 2019 is set to take place from 26th-27th March 2019 in Brussels, Belgium, with the organizers of the event now finalizing the programme. At the event, while the Day One kicks off with the sessions, Propelling the Power Electronics Revolution, Speeding Communication and Targeting Transportation, Day Two will cover Opportunities for LEDs and Lasers and Pushing the Performance Envelope.

During the two-day conference delegates will hear over 40 talks that have been divided into five themes as well as a keynote presentation and presentations from leading market analysts.

According to Richard Stevenson, Programme Manager for CS International and Editor of Compound Semiconductor magazine, the organizers have secured some of the biggest names from all the key sectors within our industry, to offer a tremendous line-up of speakers. There will be many great presentations to look forward to; from across the globe including the likes of Sony, ROHM Semiconductor, Asahi Kasei and Qorvo there will be many companies to talk to at the exhibition. These conversations could be very valuable, as they could offer insights into significant improvements in chip manufacturing.

Presentations at the event will be grouped into five key themes for the 2019 conference which collectively provided complete coverage of the compound semiconductor industry. Each industry key theme will include a keynote presentation from a leading industry figure, as well as an analyst presentation tailored to the theme,

  • Targeting transportation
  • Pushing the performance envelope
  • Speeding communication
  • Propelling the power electronics revolution
  • Opportunities for LEDs and lasers

Another highlight of CS International will be the CS Awards ceremony at the end of Day 1. This will celebrate successes across the compound semiconductor industry - ranging from suppliers of materials, equipment and software, to chip makers and device packagers.

Click here for full agenda of the event. Click here for more highlights from the event.


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