http://cdn.specpick.com/images/photonics/molex_wall.JPG712370

Molex, at the OFC 19 event, is featuring several next-generation optical interconnect, wavelength management, optoelectronic and optical subsystem solutions for dynamic high-bandwidth telecommunications and network solutions. Also on the showcase are high-speed optical transceivers, flexible and scalable optical transport products, compact connectors and fiber management, which are all vital capabilities to building high-bandwidth and high-density communication equipment needed to serve telecom, enterprise and hyperscale data centers.

To help build the infrastructure of tomorrow’s optical networks, Molex is featuring several public and private demos, including:

• OptoConnect Optical Enclosures – OptoConnect optical management solutions simplify complex fiber mapping while greatly reducing intra-system cabling footprints in advanced network architectures.
• Fiber Management Solutions for COBO Based Optical Engines – A COBO module-based reference layout board including high-density front panel Optical EMI shielding adapters, blind mating optical backplane interconnects and on-card optical cabling featuring FlexPlane technology is highlighting how system vendors can implement COBO on board optical module-based architectures.
• Dirac – the latest offering of high-port-count WSS for route-and-select architectures that demand 32+ ports.
• BittWare, a Molex Company, is previewing its SVL-29P – a PCIe board with dual 400G-compatible ports directly connected to a Xilinx VU29P FPGA. This FPGA utilizes the new 58 Gbps PAM-4 transceivers. The low-profile SVL-29P is an excellent board for those who want to get a head-start on 400G FPGA-based designs.
• Molex is itself demonstrating interoperability of its 400G DR4, 100G optics modules and 3m QSFP-DD DAC cables with Cisco N3432D-S switch, Innovium TERALYNX Switch and Keysight Technologies IXIA AresONE. (The following demos are by appointment only.)
• C+L band EDFA and Raman Amplifier highlight how a compact, low-loss DGE can greatly reduce accumulated gain error, eliminate dynamic gain ripple and lower the noise figure.
• Molex is also demonstrating its coherent module capable to achieve 400G transmission and low power consumption. Performances under 16-QAM modulation at 60G baud rates will be shown in real-time for critical parameters.

Molex has also partnered with other Optical Internetworking Forum (OIF) members attending OFC 2019 to showcase interoperability of Common Electrical Interface (CEI) solutions over a range of channel reaches and modulations. Live technology demonstrations featuring Molex solutions include:

• Cables with Connector/Cage and Cables Demo: A baseline draft of the CEI 112G LR Implementation Agreement has been developed. This demonstration, which establishes early stage feasibility for this topology, utilizes Molex’s QSFP-DD (Double Density) passive copper cable.
• CEI-112G-VSR SerDes with Module: demo incorporates multiple silicon supplier products operating over a 112 Gbps PAM-4 VSR (chip-to-module) link. This demo utilizes Molex’s QSFP-DD, a CEI-112G-VSR interface, to electrically drive interoperating HCB/MCB test boards.

Molex is at the Optical Networking and Communication Conference and Exhibition (OFC) form March 5-7, 2019 at the San Diego (CA) Convention Center in Booth 2807.

Click here for more highlights from the event.