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Sivers Semiconductors AB, a leading supplier of integrated chips and modules for the most advanced communications and sensor solutions, announced that its subsidiary Sivers Photonics has signed a product development agreement with an undisclosed company.

Beginning with an initial contract valued at USD $1.3 million for delivering prototypes in 2024, the agreement is expected to grow rapidly during 2025, before moving to volume manufacturing.  Upon entering full production, the annual chip volume is anticipated by the customer to exceed several million units per annum beyond 2026.

Sivers, a recognized leader in advanced customised lasers for high-speed optical solutions, is ideally placed to capitalize on the rising demand for next-gen laser chips that enable solutions to voracious AI computing demands. The company's optical communication technology already powers applications requiring high bandwidth and low latency data transmission.  The new collaboration will further expand Sivers' footprint into the rapidly evolving AI hardware sector.

"As optical solutions become essential for advanced AI workloads, our technology will help power the light-speed data transmission this new computing paradigm demands. This is a fantastic opportunity short term and is a mega opportunity for exceptional continued growth from 2026," said Anders Storm, Group CEO of Sivers Semiconductors.

Click here to learn more about Sivers Semiconductors' InP100 platform.