IICIE 2026 to Explore the Future of Integrated Circuits and Smart Manufacturing

Posted  by GoPhotonics

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IICIE 2026, the International Integrated Circuit Innovation Expo, will be held at the Shenzhen World Exhibition & Convention Center, China from 9 - 11 September 2026. The event brings together the entire semiconductor ecosystem including IC design, wafer fabrication, packaging, and testing equipment, materials, and core parts. Designed as a comprehensive platform for product showcases, technical exchange, business networking, and discussions on innovation, IICIE aims to drive new momentum for the global semiconductor industry.

Where Hot Technologies Meet Industry Frontlines

IICIE 2026 reflects the major trends shaping the semiconductor industry in 2026, including AI computing power, HBM, lithography, advanced nodes, advanced packaging, compound semiconductors, and optoelectronic integration. By showcasing cutting-edge technologies and innovations from around the world, the expo helps attendees stay ahead of technology trends, seize market opportunities, and address critical industry challenges.

Three Mega-Shows, One Massive Impact

IICIE 2026 will run concurrently with CIOE (China International Optoelectronic Exposition) and elexcon (Shenzhen International Electronics & Embedded Expo). Together, the three shows cover 340,000 square meters, bring together over 5,000 exhibitors, and are expected to attract more than 240,000 professional visitors. This powerful convergence connects semiconductors, optoelectronics, and embedded electronics, enabling cross-sector collaboration and creating a high-impact ecosystem for industry-wide exchange.

Global Reach, Premium Buyer Network

Due to the combined strength of three co-located events, IICIE 2026 offers a world-class buyer network spanning the United States, Germany, the United Kingdom, India, Indonesia, Malaysia, Japan, Korea, Singapore, and beyond, giving exhibitors direct access to global sourcing opportunities and expanded international partnerships.

Global attending companies include (partial list in alphabetical order):

ADVANTEST, AGC, Applied Materials, ASM International, ASMPT, BASF, Canon, DENSO, DISCO, DOW Chemical, GlobalFoundries, Honeywell, Infineon, Intel, KLA, Lam RESEARCH, Marvell, NIKON, NVIDIA, OSI Electronics, Samsung Semiconductor, Source Photonics, STMicroelectronics, Texas Instruments, Tokyo Electron, Tower Semiconductor, UMC, United Link, and more.

Full-Chain Access Across Industries and Applications

With three shows under one roof, attendees can explore the entire value chain in one go from chips - devices - modules - solutions - applications. Exhibitors can connect with key players ranging from IDMs, fabless, fabs, and OSATs to downstream sectors including AI, consumer electronics, automotive, communications and computing, displays, optoelectronics, and energy. For attendees, one badge unlocks all three shows, making it the most efficient way to explore the entire industry ecosystem.

Bridging Academia and Industry to Accelerate Commercialization

IICIE 2026 works closely with top research institutes, universities, and key labs to showcase cutting-edge R&D outcomes and create a seamless pathway from research to development to market. 

Participating institutions include: Beijing Institute of Technology School of Integrated Circuits and Electronics, Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangdong Institute of Semiconductor Micro-Nano Manufacturing Technology, HKUST, HKUST Fok Ying Tung Research Institute, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Polytechnic University School of Integrated Circuits, Shenzhen Technology University College of Integrated Circuits and Optoelectronic Chips, Shenzhen University of Advanced Technology SUAT- FACULTY OF COMPUTILITY MICROELECTRONICS, SJTU Wuxi Photonic Chip Research Institute, South China Normal University School of Microelectronics, Sun Yat-sen University School of Integrated Circuits, Tsinghua University School of Integrated Circuits, and others.

An End-to-End Semiconductor Manufacturing Matrix - Powered by Industry Leaders

IICIE 2026 builds a complete industrial framework covering manufacturing - packaging & testing - equipment - materials - parts, where global leaders showcase their core strengths:

Three co-located exhibitions unite premium exhibitors across semiconductor manufacturing, assembly, and testing: AIT Precision, ALL-Semi, ASE, ASMPT, Attach Point, BOZHON Semiconductor, Cotest, DC Precision, Deserved Semi, Direc Precision Engineering, Energy Intelligent, Eternal Technologies, GlobalFoundries, GMT Global, HEYAN Intelligent, ISMC, Jing Chuang Advanced Electronic, LASER X, LIEQI Intelligent, Micro Power, Microview Intelligent, OptoIntel, Oxford Instruments, Precision, Previse, QISHENG, Sanying MotionControl, Semtech, Shangjin Automation, SURUGA SEIKI, TechSense, Tower Semiconductor, USI, WEIDY, Yilong Semiconductor, Yoshinaga Shoji, ZHICUBIC, and many others.

IC Pavilion: Full Product Coverage Driving the Industry Forward

As the heart of the industry, IICIE 2026 brings together a complete range of IC products including AI chips, communication chips, memory chips, CPUs, sensors, analog/digital chips, power management ICs, RF chips, and driver ICs. Exhibitors will demonstrate major breakthroughs in high-performance, high-reliability, automotive-grade, and industrial-grade chips. Attending exhibitors include Empyrean, Ingenic, Montage Technology, Semitronix, Zhaoxin Semiconductor, ZTE Microelectronics, and others. 

Global Experts Gather in High-Level Forums

IICIE 2026's concurrent forums serve as a global thought leadership hub for the semiconductor industry. More than 20 forums will cover topics including semiconductor manufacturing, advanced packaging and testing, compound semiconductors, advanced manufacturing, chips and applications.

Featured forums include: 

  • Integrated Circuit Innovation Forum: Top academicians and industry leaders will gather to discuss hot topics such as AI empowerment, chip-cloud synergy, and supply chain resilience.
  • IWAPS International Workshop on Advanced Patterning Solutions: Full-chain coverage from lithography and metrology to photoresists, featuring industry giants such as KLA (US), SIEMENS (Germany), FUJIFILM (Japan), ALLCHIP PERCEPTION, and DJEL. 
  • Global Semiconductor Analysts Conference: Gathering industry experts from 25 countries to forecast market cycles and capacity strategies for 2026–2030.

Additional sessions dive deep into semiconductor manufacturing & advanced packaging and testing. These sessions will focus on breakthroughs in HPC packaging technologies, heterogeneous integration, key materials for AI heterogeneous integration packaging, and the localization of core components - all aimed at overcoming critical bottlenecks that constrain the industry. Concurrently, the IC Design and Application series forum will cover hot application areas such as AI, consumer electronics, automotive, RISC-V, industrial, and smart terminals, creating a vital link ;between chip technology and end-device requirements.

With three shows running together, attendees can also join other semiconductor-related conferences, including the -, Optical Semiconductor Inspection Technology Forum, Ultra-Precision Micro/Nano Optical Manufacturing Technology Forum, Nanoimprint Manufacturing Technology Forum, and Laser Technology Empowering Semiconductor Industry Manufacturing Forum.
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