The EPIC Online Technology Meeting on PIC Packaging and Testing 2022 is an online event held on 21st November 2022. This meeting will discuss new trends and considerations for packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die-level packaging and testing, thermal control, volume vs prize, and new manufacturing needs in co-package optics. Key players in the packaging field will discuss the adoption of standards, and packaging requirements for new applications including quantum photonics.