HLJ to Use Oxford Plasma Etch & Deposition Solutions for VCSEL Fabrication of 6-inch Wafers

Posted Oct 07, 2019 by Oxford Instruments

Oxford Instruments has announced that it will be providing its Inductively Coupled Plasma (ICP) etch and Plasma Enhanced Chemical Vapour Deposition (PECVD) systems on cluster platforms to Taiwan-based HLJ Technology Co. Ltd for the production of 6-inch VCSEL wafers. Oxford Instruments is a leading provider of plasma etch and deposition optoelectronics solutions for the laser fabrication market.

HLJ is a pioneer of VCSEL production in Taiwan with an outstanding international reputation. Recently, it had built a mass production line for 6-inch VCSEL wafers to enhance efficiency, and expedite greater control of production lead-times, capacity and quality. The in-house line integrated epitaxial structure design, growth, wafer processes and reliability tests. HLJ is committed to providing one-stop VCSEL devices shopping services for global users.

Oxford will be providing HLJ with its Cobra ICP and PECVD process solutions that are designed to support leading edge device fabrication such as VCSELs.


PlasmaPro 100 Cobra ICP: The PlasmaPro 100 Cobra ICP utilizes high-density plasma to achieve fast etching and deposition rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 200mm.  Oxford’s systems have a wide install base within high volume manufacturing (HVM), with well-developed process solutions. The PlasmaPro 100 Cobra supports a number of markets including, MEMS & sensors, GaAs & InP laser optoelectronics, SiC & GaN power electronics, and RF.

PlasmaPro 100 PECVD: The PlasmaPro 100 PECVD process modules are specifically designed to produce excellent uniformity and high rate films, with control of film properties such as refractive index, stress, electrical characteristics and wet chemical etch rate.