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MRSI Systems, a subsidiary of Mycronic Group and a leading provider of eutectic and epoxy die bonding systems, will be exhibiting its 1.5 micrometers die bonder (MRSI-H-LD) for high-volume manufacturing of advanced photonics at productronica 2019. One of world's leading trade fair for electronics development and production, productronica 2019, will be held from November 12-15 in Messe Munchen, Germany at its Booth #341 in Hall A3.
The MRSI-H-LD system is optimized for applications that bond large die for high-power laser diodes, industrial lasers, optical fiber amplifiers, power amplifiers, lighting, and sensors. This versatile assembly solution enables our customers to scale their business by delivering high throughput, high reliability, and high flexibility. MRSI recently announced the upgrade of the machine accuracy to ±1.5 micrometers at 3 sigma for the high-speed product line, under their new names: MRSI-HVM and MRSI-H.
Mycronic, MRSI's parent company is engaged in the development, manufacture, and marketing of production equipment with high precision and flexibility requirements for the electronics industry.
