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Plessey Semiconductors, an embedded technologies expert, in partnership with Compound Photonics (CP), a leading provider of compact high-resolution microdisplay solutions, has developed the first fully addressable microLED display modules. These new modules are a result of their previously announced strategic partnership to develop and introduce GaN-on-Silicon microLED based microdisplay solutions for AR/MR applications.

CP and Plessey engineering teams successfully fabricated functional microLED display modules combining CP’s industry-leading high speed digital low-latency display backplane with Plessey’s breakthrough GaN-on-Silicon monolithic microLED array technology. Plessey’s team produced the microLED array wafer bonded to CP’s backplane wafer at its Plymouth, UK, facility. In turn, CP’s team assembled and packaged display modules from the bonded wafer pair at its Phoenix, AZ, USA, facility. Both teams are currently performing initial characterization work at CP’s Vancouver, WA, USA, facility.

According to Mike Lee, President of Plessey, the successful proof-of-concept demonstration validates both companies’ goals to produce the industry’s highest performance microLED display modules that deliver improved brightness at the smallest pixel sizes, higher frame rates, with extended bit depth at the lowest power consumption to best serve next generation emissive display based AR/MR smart glasses and Heads-Up/Head-mounted displays (HUD/HMDs) applications.

These prototype microLED displays, according to Yiwan Wong, the CEO of Compound Photonics, provide important confirmation that Plessey’s monolithic GaN-on-Silicon IP, fabrication technology and bonding processes match perfectly with CP’s industry leading 3.015 micron pixel pitch 1080p (1920x1080 pixel) backplane design to deliver compact high resolution microdisplays.

Combined with CP’s NOVA high-performance display driver architecture, the microLED displays support an industry standard MIPI interface to take advantage of CP’s unique display pipeline solution designed for the real time needs of AR/MR applications. CP’s display drive technology is extensible across multiple display technologies enabled by full software configurability, allowing customers to build their systems for specific power and performance needs.

Initial samples of a 0.26 inch diagonal, full HD 1080p resolution microLED display module integrated with display driver IC and MIPI input are expected to be available by summer of 2020.