Kulicke & Soffa Launches Next-Gen Laser-Based Die Transfer System for Advanced Display Solutions

Posted  by GoPhotonics


Kulicke and Soffa Industries, a global leader in the design and manufacture of semiconductor, LED, and electronic assembly equipment, announced that it has launched a next-generation mini and micro-LED die-transfer system – LUMINEX™ which provides a new level of throughput and operational flexibility accelerating the adoption of high-volume backlighting and ultimately self-emissive display technologies. This platform supports the sorting, mixing and pitch adjust steps, in addition to the final-placement process, expanding Kulicke & Soffa's market access to this emerging high-growth advanced-display opportunity.

LUMINEX is a disruptive laser-based mini and micro-LED die-transfer solution. This highly flexible system is capable of single die transfer, multi-die transfer, and mass transfer supporting sorting, mixing, re-pitching, and placement process steps. The broad flexibility of this system addresses the growing advanced display value chain and supports the needs of LED, OSAT, panel, and display suppliers. The Company expects mini LED-backlit displays currently represent only 3% of display capacity and will accelerate to reach 20% penetration levels by 2025. During this same period, mini LED direct-emissive technologies are to grow to 18% by 2025, creating strong growth prospects for its growing portfolio of advanced display solutions.

Nelson Wong, Kulicke & Soffa's Senior Vice President of Global Sales and Supply Chain, said, "Adoption continues to accelerate, and we continue to support several active customer engagements across the advanced display value chain. We are also positioned well to enable growth in the micro-LED market with an ongoing customer engagement."

According to TrendForce, a world-leading market intelligence provider, 4.7 million 4" mini LED wafer equivalents will be deployed in backlighting applications in 2026. In parallel, about 4.6 million 4" mini LED wafer equivalents will be deployed in direct-emissive displays by 2026. Over the coming years, the Company also anticipates micro LED to enable next-generation premium direct-emissive displays which further accelerate long-term prospects within its advanced display portfolio.

Click here to know more about Wafer Level Bonder.