MRSI Releases New Die Bonder With Elevated Throughput for High Power Laser Die Attachment Applications

Posted  by GoPhotonics

712370

MRSI Systems (Mycronic Group) has announced the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD, tailored for high-power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. MRSI-H-HPLD+ will be available in the 3rd quarter of 2022.

“MRSI’s die bonders have been widely used over many years by high power laser manufacturers. This new HPLD+ version takes the performance to the next level. This new product continues with our proven track record of providing a combination of ultra-precision, high-speed, and high flexibility. This is critical for our customers’ high-mix high-volume flexible manufacturing,” said Dr. Yi Qian, Mycronic Group’s Vice President and General Manager for MRSI Systems.

MRSI Systems is the leading manufacturer of fully automated, high-speed, high-precision, and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging.

Click here to learn more about MRSI systems.
View More