In its private suite at the Optical Fiber Communication conference & exposition (OFC 2015) in Los Angeles (24-26 March), fabless integrated silicon photonics system-on-a-chip company Skorpios Technologies is demonstrating its 100G-CWDM (coarse wavelength-division multiplexing) solutions in industry-standard form factors and proprietary ultra-high-density (system-on-a-chip) form factors.

Skorpios says that its demonstration and roadmap address requirements of the data-center market to bring high-density, low-cost, low-power and single-mode fiber duplex optical solutions to 100G networking, with a platform to easily scale to 400G.

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Highlighting its proprietary Skorpios' Template Assisted Bonding (STAB) process, Alfredo Viglienzoni (senior VP of sales, marketing & business development) is discussing the state of silicon photonics market opportunities and participating in the OFC Symposium 'Beyond The Gold Box: The Future of Integrated Optics'.

Viglienzoni said that there was no other platform capable of achieving the high level of integration and scalability that Skorpios STAB enables. The application spaces are limitless in scaling data rate, lambdas and link distance. Moreover, these benefits can be achieved at mature CMOS industry cost.

Skorpios will deliver its first pluggable transceiver, the QSFP28-CWDM, 100G that support the CWDM4 MSA and CLR4 Alliance industry standard specifications. Skorpios also will begin deliveries of their Tunable Laser for Coherent transmission, which can be packaged in a micro ITLA form factor or other custom form factors. With these products, Skorpios enables the most highly integrated, lowest power dissipation and highest-density form factors available in the market. With the capabilities enabled by the STAB platform, Skorpios is offering two such diverse products simultaneously.