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Lumispot Tech, a leading provider of laser pump sources, light sources, and related application systems for special fields, has launched LM-8xx-Q4000-F-G20-P0.73-1 series, multi-peak laser diode array with fast-axis collimation, to address the challenges posed by temperature-induced wavelength shifts in semiconductor lasers.
This innovative product expands the number of laser diode emission lines, maintaining stable absorption by the solid gain medium over a wide temperature range. By doing so, it reduces the need for complex temperature control systems, thereby decreasing the laser's size and power consumption while ensuring high energy output. Utilizing advanced bare chip testing systems, vacuum coalescence bonding, interface material and fusion engineering, and transient thermal management, the company ensures precise multi-peak control, high efficiency, advanced thermal management, and long-term reliability and lifespan of their array products. This solution is particularly beneficial for applications requiring miniaturization, such as autonomous driving, laser ranging, and LiDAR.
Product Features
Controllable Multi-Peak Emission
As a pump source for solid-state lasers, this innovative product was developed to expand the stable operating temperature range and simplify the laser’s thermal management system amidst trends towards semiconductor laser miniaturization. With their advanced bare chip testing system, the company can precisely select bar chip wavelengths and power, allowing control over the product's wavelength range, spacing, and multiple controllable peaks (≥2 peaks), which broadens the operational temperature range and stabilizes pump absorption.
Fast-Axis Compression
This product uses micro-optical lenses for fast-axis compression, tailoring the fast-axis divergence angle as per specific requirements to enhance beam quality. The company's fast-axis online collimation system allows for real-time monitoring and adjustment during the compression process, ensuring that the spot profile adapts well to environmental temperature changes, with a variation of <12%.
Modular Design
This product combines precision and practicality in its design. Characterized by its compact, streamlined appearance, it offers high flexibility in practical use. Its robust, durable structure and high-reliability components ensure long-term stable operation. The modular design allows for flexible customization to meet customer needs, including wavelength customization, emission spacing, and compression, making the product versatile and reliable.
Thermal Management Technology
For the LM-8xx-Q4000-F-G20-P0.73-1 product, the company uses high thermal conductivity materials matched to the bar's CTE, ensuring material consistency and excellent heat dissipation. Finite element methods are employed to simulate and calculate the device's thermal field, effectively combining transient and steady-state thermal simulations to control temperature variations better.
Process Control
This model uses traditional hard solder welding technology. Through process control, it ensures optimal heat dissipation within the set spacing, not only maintaining the product’s functionality but also ensuring its safety and durability.
Product Specifications
The product features controllable multi-peak wavelengths, compact size, light weight, high electro-optical conversion efficiency, high reliability, and long lifespan. The company's latest multi-peak semiconductor stacked array bar laser, as a multi-peak semiconductor laser, ensures that each wavelength peak is clearly visible. It can be precisely customized according to specific customer needs for wavelength requirements, spacing, bar count, and output power, demonstrating its flexible configuration features. The modular design adapts to a broad range of application environments, and different module combinations can meet various customer needs.
Click here to learn more about LSP's Automotive LiDAR.
