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Oclaro Inc has announced general market availability of its 100G PAM4 EA-DFB EML chips for next-generation transceiver applications. Oclaro’s EML chips operating at 53 Gbaud with up to 40 GHz bandwidth (@ 20°C) and 6dB extinction ratio (@70°C) are ideal for use in pulse amplitude modulation-based (PAM4) transceivers, enabling 100 Gbps per wavelength. Combining high-performance and low power consumption, these chips pave the way for the next wave of 200 Gbps and 400 Gbps in data center networks.
Oclaro also announced additional wafer fab capacity upgrades for DML and EML laser production, providing greater availability for its world-class components. This newly installed production capacity will enable the company to satisfy the increasing demand for cost-effective high-speed transceivers. Its proven laser technology has been the benchmark for high-performance and reliability, and is ideally suited to support the PAM4 modulation formats used to deliver higher-speed networks affordably. With the explosive growth of large scale data centers, the demand for these lasers has never been greater and by increasing its manufacturing capacity, Oclaro can ensure its customers have the supply they need to be successful.
Oclaro's high-speed 25G DML chips are well suited for 100 Gbps CWDM4 transceivers and have been produced in high volume for the last two years. They can also be used in low-cost SFP28 modules and other 25 Gbps products for high-volume, low-cost applications. The EML devices provide the high bandwidth and linearity needed for next-generation 200 Gbps and 400 Gbps transceivers using PAM4, while still maintaining small size and low cost.
Oclaro's laser chips support both CWDM4 and LAN-WDM wavelength standards, and in many applications, un-cooled operation and non-hermetic packaging can be employed for low-cost, high performance module solutions, including PAM4 transceivers for higher data rates.
The 100 Gbps PAM4 EML chips are ready for sampling today.