Optical fiber can carry massive amounts of data across huge distances. With its' silicon photonics modules, Intel brought fiber all the way to the edge of the rack, up to each server. But to enter the server's compute environment, these light signals are converted to electrical signals, which have lower bandwidth density.

Extending the high speed, high bandwidth density optical path directly into the package, would unlock the full potential of this technology. To achieve this, Intel engineers developed a novel coupler that can be attached and detached from the package. This flexible method supports diverse use cases for both existing and advanced packed technologies and enables high packaged yields needed for manufacturing. A breakthrough that allows us to bring light right into the processor package and unlock a bright future for silicon photonics.