A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a
CMOS based Optical InterposerTM
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A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a
CMOS based Optical InterposerTM
- Author:
Suresh Venkatesan, James Lee, Simon Chun Kiat Goh, Baochang Xu, Aaron Thean, Yeow Kheng
: In this paper, we present a unique hybrid integration platform for wafer scale passive assembly of electronics and photonics devices using a CMOS based Optical Interposer. Our optical interposer enables seamless communications between electronics and photonics chips that are assembled on it using visually assisted passive flip chip bonding techniques.
