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Advanced Green Nanosecond Lasers Excel at Thin SIP and Thick PCB Cutting

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Advanced Green Nanosecond Lasers Excel at Thin SIP and Thick PCB Cutting

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Printed circuit board (PCB) manufacturing requires a wide variety of processes, many of which are now performed using lasers. The migration towards laser technology has been largely driven by a reduction in feature sizes and increased complexity, which ultimately allows for higherperforming electronic devices in smaller form factors and with reduced power consumption. Processes such as via drilling have seen a progression from mechanical drill to CO2 laser, and more recently UV nanosecond pulse lasers, as the required diameters have continued to shrink. Devices and modules have also become more compact through advanced packaging. Recognizing there is a large disconnect between semiconductor node and PCB dimensionality—from nanometers to millimeters in extreme cases—developers continue to focus on advanced packaging techniques for these interconnections

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