1.  Home
  2. Whitepapers
  3. System-in-Package (SiP) Manufacturing

System-in-Package (SiP) Manufacturing

Download Whitepaper

System-in-Package (SiP) Manufacturing

Download Whitepaper
To help maintain the pace of growth in the number of transistors on a chip, new innovations in semiconductor manufacturing are needed. One area of innovation focuses on how chips are packaged. As traditional chip-level scaling is reaching its limits, an alternative is system-level scaling through system-in-package (SiP). Also known as 2.5D/3D packaging, SiP enables heterogenous integration, which is the packing of individual semiconductor chips with various functions such as memory and logic onto a single substrate to achieve system-level performance. Thus, SiP has the potential to continue and possibly exceed the growth trajectories for the number of transistors on a chip. In order to improve and advance SiP packaging, lasers are required to perform processes that traditional methods cannot, especially when working with materials such as ceramics, organics and even glass.

Download Whitepaper Now