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Testing Next-Gen PIC-Based Transceivers

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Testing Next-Gen PIC-Based Transceivers

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There’s a technological solution to all three challenges: components based on photonic integrated circuits (PIC). PICs are the cornerstone for building high-speed communication networks enabled by modern high-speed optical transceivers. These optoelectronic devices combine passive and active optical functions within a single monolithic structure (chip) which is then integrated into the transceiver. PICs are the disruptive technology behind the new wave of optical transceivers. Manufacturers are replacing electronic subcomponents with photonic-based ones since they boast advantages such as high integration and compactness, outstanding power consumption savings and enhanced thermal management.

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