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Infrared Assisted Electronic Subassembly Rework

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Infrared Assisted Electronic Subassembly Rework

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  • Author: Don Roy, Joyce Koo
Advanced electronic and optoelectronic systems require high density, low cost assemblies in order to meet the present market demand. Rework of such assemblies has proven to be difficult using conven-tional hot air reflow due to the space limitation and potential lifting of the thin copper trace from the fine pitch device pads. Rework is particularly difficult for full area array devices using hot air reflow due to the non-uniform heating of the area.

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