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Atomic Layer Deposition

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Atomic Layer Deposition

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Atomic layer deposition is similar to LPCVD except that the chemical process is broken down into steps that isolate different adsorption and reaction steps to have self-limiting reactions. The process employs separate pulses of precursors and reactants that pass sequentially through the process chamber. With the substrate in the process chamber and under high vacuum, an initial precursor is introduced into the chamber. ALD processes can be either thermally driven or plasma enhanced. Plasma enhanced ALD processes using direct plasma, remote plasma, and combined direct/remote plasma have been demonstrated. They are normally carried out using single-wafer cluster tool equipment configurations.

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