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Reactive Ion Etching

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Reactive Ion Etching

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Reactive Ion Etching (RIE) uses a combination of chemical and physical reactions to remove material from a substrate; it is the simplest process that is capable of directional etching. A highly anisotropic etching process can be achieved in RIE through the application of energetic ion bombardment of the substrate during the plasma chemical etch. The RIE process thus provides the benefits of highly anisotropic etching due to the directionality of the ions bombarding the substrate surface as they get accelerated towards the negatively biased substrate, combined with high etch rates due to the chemical activity of the reactive species concurrently impinging on the substrate surfaces.

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