1.  Home
  2. Whitepapers
  3. Wafer Surface Cleaning

Wafer Surface Cleaning

Download Whitepaper

Wafer Surface Cleaning

Download Whitepaper
The increase in etch and deposition steps, new materials, and new structures used in 2.5D and 3D packaging rely heavily on cleaning processes like photoresist strip and descum to ensure contamination free surfaces. Devices require varying levels of cleanliness using different materials throughout the manufacturing process so it is increasingly important to offer multiple cleaning options to achieve the required clean levels to ensure good devices and high yield. Surface activation, an important process tied to cleaning, conditions and prepares the surface for the next process step ensuring good quality adhesion resulting in high quality die.

Download Whitepaper Now