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Trapping-Why, How, and Where

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Trapping-Why, How, and Where

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  • Author: Barry Page
The gaseous effluent stream from deposition and etch processes contains excess precursors and process byproduct materials with characteristics of the process chemistry. These precursors and byproducts can condense or react to produce solid and/or crystalline structures (particles) that adhere to walls, components, and even transform under certain conditions. The buildup of these deposits throughout the exhaust system are of concern because they can adversely affect the process parameters, increase tool maintenance, and affect film parameters. Even the in-situ cleans can be affected by changing line conductance.

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