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Controlling Vapor Condensation And Downstream Deposits In Deposition And Etch Tools

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Controlling Vapor Condensation And Downstream Deposits In Deposition And Etch Tools

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The thin film deposition and etch technologies used in semiconductor devices, LED, MEMS, barrier films and many other advanced manufacturing processes require technologies for accurate and precise temperature control of the "wetted" surfaces, from chemical precursor delivery to exhaust gas handling systems. In both deposition and etch technologies, condensable vapors and reactive chemistries can produce condensates and/or solid deposits on the internal surfaces of precursor feed lines, process chambers, instruments and lines attached to the chamber, exhaust management system, valves, and other "wetted" areas of the system.

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