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Chamber Clean Endpoint Control

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Chamber Clean Endpoint Control

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During the deposition, process chambers become coated with process chemicals. To maintain process performance, chambers must be cleaned periodically to remove the build-up of these chemicals. The optimum clean time for a given process is a complex function of a number of variables including thickness of the deposited material, interior temperature of the chamber components, deposition/sputter ratios, and the chemical composition of the materials to be removed.

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