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The Versatile MKS Virtual Wall™ Gas Barrier Device

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The Versatile MKS Virtual Wall™ Gas Barrier Device

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Particulate contamination is a critical challenge in semiconductor device manufacturing. Chemical Vapor Deposition (CVD) processes, in particular, are sensitive to particle contamination, since the gas feeds form solid products either by thermal decomposition or reaction with co-reagents. A properly set up CVD process runs under conditions such that solid product formation in the process chamber occurs only on the surfaces (including the wafer surface) and not in the gas phase. However, the conditions in the CVD tool’s chamber exhaust and pump forelines differ from those in the process chamber, and both surface deposition and gas phase nucleation are possible and the accumulation of loosely adherent masses of particles can occur within these parts of the system. Particles in these areas can backstream into the process chamber during certain process steps, depositing on the wafer surface and producing defects that reduce wafer yields

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