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Reduce Ultrapure Water (UPW) Usage Using MKS Reclaim Technology

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Reduce Ultrapure Water (UPW) Usage Using MKS Reclaim Technology

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Ozone (O3) dissolved in ultrapure water is known as DIO3. It is used in wet cleaning processes in many stages of semiconductor device manufacturing. Ozone is a strong oxidizer that reacts rapidly with most hydrocarbons, either directly or via the generation of highly reactive oxygen radicals (O• ) which react even more vigorously with organics. DIO3 is thus a highly effective cleaning agent for the removal of ambient organic molecules adsorbed on the wafer surface. When combined with dilute HF in a process known as SCROD cleaning, DIO3 is more effective than SC-1 cleans for removing metals from wafer surfaces. As well, ozone-based processes are finding increased use in reticle cleaning.

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