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Silicon Wafer Inspection with SWIR Cameras

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Silicon Wafer Inspection with SWIR Cameras

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Silicon inspection can be a challenging problem for silicon and semi-conductor manufacturers in terms of pattern alignment, pattern defect inspection and edge position bonding inspection. During the manufacturing process, foreign particles and defects may appear on the top, bottom, inside or in between the wafers. And as the thickness of wafers get smaller, the backside defects are becoming more important to detect. They include trapped air, air pockets, micro-cracks and other fine features caused by photonic emissions.

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