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Material-Specific Ablation Profiles Simplify Fast Drilling of Flex PCB Microvias

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Material-Specific Ablation Profiles Simplify Fast Drilling of Flex PCB Microvias

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Laser drilling of microvias in copper/polyimide/copper (Cu/PI/Cu) laminates is a common yet critical process in flex printed circuit board (fPCB) manufacturing, driven in large part by the popularity explosion in compact mobile electronic devices such as smart phones and watches, wearable devices, and more recently advanced automotive electronics. The specific case of a so-called blind via, in which a top copper foil and underlying polyimide layer are cleanly removed-leaving behind a bottom copper layer with minimal damage-is a benchmarking process for characterizing the suitability of a laser drilling technology. Key challenges include minimal burr in the top copper opening and minimal damage to the exposed bottom copper.

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