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Picosecond Laser Burst Machining of Silicon to Enhance Material Removal Rate and Quality

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Picosecond Laser Burst Machining of Silicon to Enhance Material Removal Rate and Quality

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Machining of silicon is important in various industries such as integrated circuit (IC) back-end processing, microelectronics packaging and photovoltaics manufacturing. As wafer thicknesses have decreased over the years, mechanical processing has increasingly given way to laser technology due to the challenges of processing thin brittle materials with mechanical tools. Various nanosecond pulsed laser technologies have been used, including excimer, diode-pumped solid state (DPSS), and fiber. Increasingly, however, the use of ultrashort pulse laser technology is being considered to further improve quality and speed of machining. To this end, picosecond laser technology is being adopted for machining with both good quality and higher throughput. Spectra-Physics’ IceFyre® picosecond laser delivers >200 µJ pulse energy and >50 W average power at a wavelength of 1064 nm. IceFyre’s TimeShift™ ps technology offers versatile burst mode operation with variable separation time between the pulses within a burst.

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