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Micromachining Transparent, Brittle Materials with IceFyre™ Picosecond Laser

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Micromachining Transparent, Brittle Materials with IceFyre™ Picosecond Laser

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Transparent and/or brittle materials such as glass, ceramics, and crystals are historically difficult to machine with good quality and high throughput. Traditional mechanical processes are often too harsh and, especially for thinner materials, must be slowed down to prevent severe cracking and chipping of the material. In addition, tool wear is problematic because the cutting edges are continually degrading throughout its lifecycle and the quality, yield, etc. of the processed parts are likely to also degrade-this on top of the consumable replacement cost that can be quite high over time. Furthermore, hard brittle materials result in high rates of tool wear and the consumable cost over time can become excessive. Hence, manufacturers have increasingly looked towards laser technology as a solution.

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