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Lasers Make the Cut for SiP Manufacturing

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Lasers Make the Cut for SiP Manufacturing

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  • Author: Jim bovatsek
Advanced packaging methods involve smaller, higher-density layouts, reduced feature sizes, and thinner substrates, often incorporating innovative materials. Together, these characteristics place greater demands on the various material processing tasks performed during manufacturing, such as cutting and drilling. Specifically, these requirements include increased dimensional accuracy and higher precision to support the creation of smaller features, as well as smaller Heat Affected Zones (HAZ) to enable closer feature placement. All of this must be achieved while maintaining throughput, quality, and cost-effectiveness

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