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System-in-package materials cutting using MKS Instruments’ Spectra-Physics IceFyre GR50 green picosecond laser

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System-in-package materials cutting using MKS Instruments’ Spectra-Physics IceFyre GR50 green picosecond laser

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System in package (SiP) is a chip packaging approach for further increasing the density of computing power. With semiconductor feature shrink slowing, the industry has turned toward the gap that exists between semiconductor processing dimensions (nanometresmicrometres) and printed circuit board (PCB) dimensions (micrometres-millimetres), a space spanning roughly three orders of magnitude.

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