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Pulse Tailoring with UV Laser Source Improves Throughput and Quality for High-Density Packaging Glass Interposer Drilling

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Pulse Tailoring with UV Laser Source Improves Throughput and Quality for High-Density Packaging Glass Interposer Drilling

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  • Author: Jim BOVATSEK, Rajesh PATEL, Philipp VON WITZENDORFF, Andrea BORDINA, Oliver SUTTMANN, Ludger OVERMEYER
Laser processing of glass and other transparent brittle materials is of increasing importance for the manufacturing of a wide range of products we use on a daily basis. For touch panel displays on mobile devices, lasers have shown themselves as capable tools for cutting chemically strengthened glass with both high speed and good quality. Some researchers have characterized the machining capability of ns pulses with different wavelengths on ustrengthened borosilicate glass. For the LED lighting industry, lasers have been a valuable tool over the years for device singulation on the sapphire substrate. Currently, glass is increasingly considered as an interposer material for advanced high density IC packaging architectures, and lasers are being considered as a tool for drilling the through-glass vias (TGVs) required for lead connections.

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