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Thermal Design of a Through Hole Substrate for the Heat Dissipation of the LEDs

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Thermal Design of a Through Hole Substrate for the Heat Dissipation of the LEDs

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To design LED products, it is essential to take thermal expansion into account. The operating temperature of the LEDs is determined by the junction temperature (TJ). When the junction temperature exceeds the maximum value specified for each model, the luminous flux is significantly decreased, resulting in catastrophic failures such as no light emission due to wire breakage. Therefore, it is necessary to use LED products so that the junction temperature (TJ) does not exceed the maximum value. The optimal TJ will enable LED products to have a long life. It is required, therefore, to achieve the optimal thermal design for LED products. In this application note, Nichia will recommend the design of Through Holes as a method of heat dissipation by verifying prototypes

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